HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 668

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 21 Electrical Characteristics
21.2.5
Table 21.18 lists the D/A conversion characteristics.
Table 21.18 D/A Conversion Characteristics
Conditions: V
Rev. 2.00 Sep 20, 2005 page 628 of 800
REJ09B0260-0200
Item
Resolution
Conversion time (centering time)
Absolute accuracy
D/A Conversion Characteristics
fmax = 25 MHz, T
T
a
CC
= –40°C to +85°C (wide-range specifications)
= 3.0 to 3.6 V, AV
a
= –20°C to +75°C (regular specifications),
Min
8
—
—
—
CC
= 3.0 to 3.6 V, V
Typ
8
—
±2.0
—
Max
8
10
±3.0
±2.0
REF
= 3.0 to AV
Unit
bits
µs
LSB
LSB
CC
, V
Test Conditions
20 pF capacitive load
2 M resistive load
4 M resistive load
SS
= AV
SS
= 0 V,