HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 455

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

13.1
The SCI supports an IC card (smart card) interface handling ISO/IEC7816-3 (Identification Card)
character transmission as a serial communication interface expansion function.
Switchover between the normal serial communication interface and the smart card interface is
controlled by a register setting.
13.1.1
Features of the smart card interface supported by the H8/3024 Group are listed below.
Asynchronous communication
Built-in baud rate generator allows any bit rate to be selected
Three interrupt sources
Data length: 8 bits
Parity bit generation and checking
Transmission of error signal (parity error) in receive mode
Error signal detection and automatic data retransmission in transmit mode
Direct convention and inverse convention both supported
There are three interrupt sources—transmit-data-empty, receive-data-full, and
transmit/receive error—that can issue requests independently.
Overview
Features
Section 13 Smart Card Interface
Rev. 2.00 Sep 20, 2005 page 415 of 800
Section 13 Smart Card Interface
REJ09B0260-0200