HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 585

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 18 Flash Memory [H8/3024F-ZTAT Version]
18.4.3
Flash Memory Emulation in RAM
In the H8/3024F-ZTAT version, flash memory programming can be emulated in real time by
overlapping the flash memory with part of RAM (“overlap RAM”). When the emulation block set
in RAMCR is accessed while the emulation function is being executed, data written in the overlap
RAM is read.
Emulation should be performed in user mode or user program mode.
SCI
Flash memory
RAM
Emulation block
Overlap RAM
(Emulation is performed on data written
in RAM)
Application program
Execution state
Figure 18.4 Reading Overlap RAM Data in User Mode/User Program Mode
When overlap RAM data is confirmed, clear the RAMS bit to cancel RAM overlap, and actually
perform writes to the flash memory in user program mode.
When the programming control program is transferred to RAM in on-board programming mode,
ensure that the transfer destination and the overlap RAM do not overlap, as this will cause data in
the overlap RAM to be rewritten.
Rev. 2.00 Sep 20, 2005 page 545 of 800
REJ09B0260-0200