HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 171

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

6.4
6.4.1
The basic bus interface enables direct connection of ROM, SRAM, and so on.
The bus specifications can be selected with ABWCR, ASTCR, WCRH, and WCRL
(see table 6.3).
6.4.2
Data sizes for the CPU and other internal bus masters are byte, word, and longword. The bus
controller has a data alignment function, and when accessing external space, controls whether the
upper data bus (D
for the area being accessed (8-bit access area or 16-bit access area) and the data size.
8-Bit Access Areas: Figure 6.6 illustrates data alignment control for 8-bit access space. With 8-
bit access space, the upper data bus (D
that can be accessed at one time is one byte: a word access is performed as two byte accesses, and
a longword access, as four byte accesses.
Byte size
Word size
Longword size
Basic Bus Interface
Overview
Data Size and Data Alignment
Figure 6.6 Access Sizes and Data Alignment Control (8-Bit Access Area)
15
to D
8
) or lower data bus (D
1st bus cycle
2nd bus cycle
1st bus cycle
2nd bus cycle
3rd bus cycle
4th bus cycle
15
to D
8
) is always used for accesses. The amount of data
7
to D
D
15
Upper data bus
0
) is used according to the bus specifications
Rev. 2.00 Sep 20, 2005 page 131 of 800
D
8
D
7
Lower data bus
Section 6 Bus Controller
REJ09B0260-0200
D
0