HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 441

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Note: * In simultaneous transmitting and receiving, the TE and RE bits should be cleared to 0
CKE0 bits in SCR (leaving TE and
Clear TE and RE bits to 0 in SCR
<Start transmitting or receiving>
Set RIE, TIE, MPIE, CKE1 and
Select communication format
Set RIE, TIE, TEIE, and MPIE
or set to 1 simultaneously.
Set TE or RE bit to 1 in SCR
1-bit interval elapsed?
RE bits cleared to 0)
Start of initialization
Set value in BRR
bits as necessary
in SMR
Figure 12.15 Sample Flowchart for SCI Initialization
Yes
Wait
Yes
(1)
(2)
(3)
(4)
(1)
(2)
(3)
(4)
Section 12 Serial Communication Interface
Set the clock source in SCR. Clear the
RIE, TIE, TEIE, MPIE, TE, and RE bits to
0. *
Set the communication format in SMR.
Write the value corresponding to the bit rate
in BRR.
This step is not necessary when an
external clock is used.
Wait for at least the interval required to
transmit or receive one bit, then set the TE
or RE bit to 1 in SCR.* Set the RIE, TIE,
TEIE, and MPIE bits as necessary.
Setting the TE or RE bit enables the SCI to
use the TxD or RxD pin.
Rev. 2.00 Sep 20, 2005 page 401 of 800
REJ09B0260-0200

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