HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 49

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

PA
PA
Note: * Functions as the RES0 pin in the mask ROM version, and as the FWE pin in the F-ZTAT version.
P8
2
3
/TP
/TP
PA
PA
3
/IRQ
4
5
2
3
/TP
/TP
/TIOCA
/TIOCB
PA
PA
3
P8
P8
4
5
0
1
P7
P7
/CS
/TIOCA
/TIOCB
/TP
/TP
1
2
Figure 1.3 Pin Arrangement of H8/3024F-ZTAT, H8/3026F-ZTAT,
6
7
/IRQ
/IRQ
/AN
/AN
1
P8
0
0
0
1
/ADTRG
P7
P7
P7
P7
P7
P8
/TCLKC
/TCLKD
H8/3024 Mask ROM Version, and H8/3026 Mask ROM Version
/TCLKA
/TCLKB
0
1
2
3
4
5
6
7
/IRQ
1
2
4
AV
1
1
/AN
/AN
/AN
/AN
/AN
/DA
/DA
/CS
/CS
/CS
/A
/A
V
SS
SS
23
22
1
2
3
4
5
0
1
0
3
2
0
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
(FP-100A Package, Top View)
Top view
(FP-100A)
Rev. 2.00 Sep 20, 2005 page 9 of 800
Section 1 Overview
REJ09B0260-0200
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
P2
P2
P2
P2
V
P1
P1
P1
P1
P1
P1
P1
P1
D /P3
D /P3
D /P3
D /P3
D /P3
D /P3
V
SS
15
14
13
12
11
10
CC
3
2
1
0
7
6
5
4
3
2
1
0
/A
/A
/A
/A
/A
/A
/A
/A
/A
/A
/A
/A
11
10
9
8
7
6
5
4
3
2
1
0
2
7
6
5
4
3