HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 581

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

18.4
18.4.1
When the mode pins and the FWE pin are set in the reset state and a reset-start is executed, the
H8/3024F-ZTAT version enters one of the operating modes shown in figure 18.3. In user mode,
flash memory can be read but not programmed or erased.
Flash memory can be programmed and erased in boot mode, user program mode, and PROM
mode.
Boot mode and user program mode cannot be used in the H8/3024F-ZTAT version’s mode 6
(normal mode with on-chip ROM enabled).
ROM blocks
EB0–EB3
(H'000000–
H'000FFF)
Overview of Operation
Mode Transitions
H'0003FF
H'0007FF
H'000BFF
H'000C00
H'000FFF
H'000000
H'000400
H'000800
Figure 18.2 Example of ROM Area/RAM Area Overlap
Mapping RAM
ROM area
EB0
EB1
EB2
EB3
ROM selection
area
RAM selection
area
Section 18 Flash Memory [H8/3024F-ZTAT Version]
Rev. 2.00 Sep 20, 2005 page 541 of 800
Actual RAM
RAM area
H'FFEFFF
H'FFEF20
H'FFF3FF
H'FFFF1F
H'FFF000
H'FFF400
REJ09B0260-0200
RAM
overlap area
(H'FFF000–
H'FFF3FF)