HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 393

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

12.1.2
Figure 12.1 shows a block diagram of the SCI.
RxD
TxD
SCK
Legend:
RSR:
RDR:
TSR:
TDR:
SMR:
SCR:
SSR:
BRR:
SCMR: Smart card mode register
Block Diagram
RDR
RSR
Receive shift register
Receive data register
Transmit shift register
Transmit data register
Serial mode register
Serial control register
Serial status register
Bit rate register
Parity generate
Parity check
TSR
TDR
Figure 12.1 SCI Block Diagram
Module data bus
Transmit/receive
control
SCMR
SMR
SCR
SSR
External clock
Clock
Section 12 Serial Communication Interface
Rev. 2.00 Sep 20, 2005 page 353 of 800
Baud rate
generator
BRR
T E I
T X I
R X I
E R I
/4
/16
/64
REJ09B0260-0200
Internal data bus