HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 700

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Appendix A Instruction Set
Rev. 2.00 Sep 20, 2005 page 660 of 800
REJ09B0260-0200
Instruction Mnemonic
Bcc
BCLR
BIAND
BILD
BIOR
BIST
BIXOR
BLD
BRA d:16 (BT d:16)
BRN d:16 (BF d:16)
BHI d:16
BLS d:16
BCC d:16 (BHS d:16)
BCS d:16 (BLO d:16)
BNE d:16
BEQ d:16
BVC d:16
BVS d:16
BPL d:16
BMI d:16
BGE d:16
BLT d:16
BGT d:16
BLE d:16
BCLR #xx:3, Rd
BCLR #xx:3, @ERd
BCLR #xx:3, @aa:8
BCLR Rn, Rd
BCLR Rn, @ERd
BCLR Rn, @aa:8
BIAND #xx:3, Rd
BIAND #xx:3, @ERd
BIAND #xx:3, @aa:8
BILD #xx:3, Rd
BILD #xx:3, @ERd
BILD #xx:3, @aa:8
BIOR #xx:8, Rd
BIOR #xx:8, @ERd
BIOR #xx:8, @aa:8
BIST #xx:3, Rd
BIST #xx:3, @ERd
BIST #xx:3, @aa:8
BIXOR #xx:3, Rd
BIXOR #xx:3, @ERd
BIXOR #xx:3, @aa:8
BLD #xx:3, Rd
BLD #xx:3, @ERd
BLD #xx:3, @aa:8
Instruction
Fetch
I
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
1
2
2
1
2
2
1
2
2
1
2
2
1
2
2
1
2
2
1
2
2
1
2
2
Branch
Addr. Read
J
Stack
Operation
K
Byte Data
Access
L
2
2
2
2
1
1
1
1
1
1
2
2
1
1
1
1
Word Data
Access
M
Internal
Operation
N
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2