HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 456

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 13 Smart Card Interface
13.1.2
Figure 13.1 shows a block diagram of the smart card interface.
Rev. 2.00 Sep 20, 2005 page 416 of 800
REJ09B0260-0200
RxD
TxD
SCK
Legend
SCMR: Smart card mode register
RSR:
RDR:
TSR:
TDR:
SMR:
SCR:
SSR:
BRR:
Receive shift register
Receive data register
Transmit shift register
Transmit data register
Serial mode register
Serial control register
Serial status register
Bit rate register
Block Diagram
RDR
RSR
Figure 13.1 Block Diagram of Smart Card Interface
Parity generation
Parity check
TDR
TSR
Module data bus
Transmission/
reception
control
SCMR
SMR
SSR
SCR
External clock
Clock
Baud rate
generator
BRR
TXI
RXI
ERI
/4
/16
/64
Internal
data bus