HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 555

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 17 Flash Memory [H8/3026F-ZTAT Version]
17.8
Flash Memory Emulation in RAM
Making a setting in the RAM control register (RAMCR) enables part of RAM to be overlapped
onto the flash memory area so that data to be written to flash memory can be emulated in RAM in
real time. After the RAMCR setting has been made, accesses can be made from the flash memory
area or the RAM area overlapping flash memory. Emulation can be performed in user mode and
user program mode. Figure 17.13 shows an example of emulation of realtime flash memory
programming.
Start of emulation program
Set RAMCR
Write tuning data to overlap RAM
Execute application program
No
Tuning OK?
Yes
Clear RAMCR
Write to flash memory emulation block
End of emulation program
Figure 17.13 Flowchart of Flash Memory Emulation in RAM
Rev. 2.00 Sep 20, 2005 page 515 of 800
REJ09B0260-0200