HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 72

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 2 CPU
Table 2.3
Instruction Size *
MOV
MOVFPE
MOVTPE
POP
PUSH
Note: * Size refers to the operand size.
Rev. 2.00 Sep 20, 2005 page 32 of 800
REJ09B0260-0200
B: Byte
W: Word
L: Longword
B/W/L
B
B
W/L
W/L
Data Transfer Instructions
Function
(EAs)
Moves data between two general registers or between a general register and
memory, or moves immediate data to a general register.
(EAs)
Cannot be used in this LSI.
Rs
Cannot be used in this LSI.
Pops a general register from the stack. POP.W Rn is identical to MOV.W
@SP+, Rn. Similarly, POP.L ERn is identical to MOV.L @SP+, ERn.
Rn
Pushes a general register onto the stack. PUSH.W Rn is identical to MOV.W
Rn, @–SP. Similarly, PUSH.L ERn is identical to MOV.L ERn, @–SP.
@SP+
(EAs)
@–SP
Rd, Rs
Rd
Rn
(EAd)