HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 120

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 4 Exception Handling
4.6
When accessing word data or longword data, the H8/3024 Group regards the lowest address bit as
0. The stack should always be accessed by word access or longword access, and the value of the
stack pointer (SP:ER7) should always be kept even.
Use the following instructions to save registers:
Use the following instructions to restore registers:
Setting SP to an odd value may lead to a malfunction. Figure 4.7 shows an example of what
happens when the SP value is odd.
Rev. 2.00 Sep 20, 2005 page 80 of 800
REJ09B0260-0200
PUSH.W Rn
PUSH.L ERn
POP.W Rn
POP.L ERn
Notes on Stack Usage
(or MOV.W Rn, @–SP)
(or MOV.L ERn, @–SP)
(or MOV.W @SP+, Rn)
(or MOV.L @SP+, ERn)