HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 394

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 12 Serial Communication Interface
12.1.3
The SCI has serial pins for each channel as listed in table 12.1.
Table 12.1 SCI Pins
Channel
0
1
Rev. 2.00 Sep 20, 2005 page 354 of 800
REJ09B0260-0200
Pin Configuration
Name
Serial clock pin
Receive data pin
Transmit data pin
Serial clock pin
Receive data pin
Transmit data pin
Abbreviation
SCK
RxD
TxD
SCK
RxD
TxD
0
1
0
1
0
1
I/O
Input/output
Input
Output
Input/output
Input
Output
Function
SCI
SCI
SCI
SCI
SCI
SCI
0
0
0
1
1
1
clock input/output
receive data input
transmit data output
clock input/output
receive data input
transmit data output

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