HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 672

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 21 Electrical Characteristics
21.3.2
Control signal timing is shown as follows:
Note: * This function is used only in mask ROM models, and is not provided in flash memory
Rev. 2.00 Sep 20, 2005 page 632 of 800
REJ09B0260-0200
RES
FWE
MD
RESO
Reset input timing
Figure 21.8 shows the reset input timing.
Reset output timing *
Figure 21.9 shows the reset output timing.
Interrupt input timing
Figure 21.10 shows the interrupt input timing for NMI and
2
to MD
models.
Control Signal Timing
0
Figure 21.9 Reset Output Timing *
Figure 21.8 Reset Input Timing
t
MDS
t
RESD
t
RESS
t
RESD
I R Q
t
RESS
5
to
I R Q
t
t
RESW
RESOW
0
.