HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 512

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 16 RAM
16.1.1
Figure 16.1 shows a block diagram of the on-chip RAM.
16.1.2
The on-chip RAM is controlled by SYSCR. Table 16.2 gives the address and initial value of
SYSCR.
Table 16.2 System Control Register
Address *
H'EE012
Note: * Lower 20 bits of the address in advanced mode.
Rev. 2.00 Sep 20, 2005 page 472 of 800
REJ09B0260-0200
Note: * This example is of the H8/3024 mask ROM version operating in mode 7. The lower 20 bits
Legend:
SYSCR: System control register
Block Diagram
Register Configuration
of the address are shown.
Name
System control register
Figure 16.1 RAM Block Diagram
Even addresses
H'FEF20 *
H'FFF1E *
H'FEF22 *
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
On-chip RAM
Bus interface
Abbreviation
SYSCR
Odd addresses
H'FEF21 *
H'FEF23 *
H'FFF1F *
R/W
R/W
SYSCR
Initial Value
H'09