HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 685

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Mnemonic
DIVXU. W Rs, ERd
DIVXS. B Rs, Rd
DIVXS. W Rs, ERd
CMP.B #xx:8, Rd
CMP.B Rs, Rd
CMP.W #xx:16, Rd
CMP.W Rs, Rd
CMP.L #xx:32, ERd
CMP.L ERs, ERd
NEG.B Rd
NEG.W Rd
NEG.L ERd
EXTU.W Rd
EXTU.L ERd
EXTS.W Rd
EXTS.L ERd
W
W
W
W
W
W
W
B
B
B
B
L
L
L
L
L
2
4
6
Instruction Length (bytes)
2
4
4
2
2
2
2
2
2
2
2
2
2
Addressing Mode and
Operation
ERd32 Rs16
(Ed: remainder,
Rd: quotient)
(unsigned division)
Rd16
(RdH: remainder,
RdL: quotient)
(signed division)
ERd32 Rs16
(Ed: remainder,
Rd: quotient)
(signed division)
Rd8–#xx:8
Rd8–Rs8
Rd16–#xx:16
Rd16–Rs16
ERd32–#xx:32
ERd32–ERs32
0–Rd8
0–Rd16
0–ERd32
0
of Rd16)
0
of ERd32)
(<bit 7> of Rd16)
(<bits 15 to 8> of Rd16)
(<bit 15> of ERd32)
(<bits 31 to 16> of
ERd32)
(<bits 15 to 8>
(<bits 31 to 16>
Rev. 2.00 Sep 20, 2005 page 645 of 800
Rs8
Rd8
Rd16
ERd32
Rd16
ERd32
ERd32
Appendix A Instruction Set
— — (6) (7) — —
— — (8) (7) — —
— — (8) (7) — —
— (1)
— (1)
— (2)
— (2)
— — 0
— — 0
— —
— —
I
Condition Code
H N Z
REJ09B0260-0200
V C
0 —
0 —
0 —
0 —
States *
No. of
22
16
24
2
2
4
2
6
2
2
2
2
2
2
2
2
1

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