HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 629

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Bits 1 and 0—Divide (DIV1, DIV0): These bits select the frequency division ratio, as follows.
19.5.3
The DIVCR setting changes the frequency, so note the following points.
Bit 1
DIV1
0
0
1
1
Select a frequency division ratio that stays within the assured operation range specified for the
clock cycle time t
operating frequency range. Ensure that ø is not below this lower limit.
All on-chip module operations are based on . Note that the timing of timer operations, serial
communication, and other time-dependent processing differs before and after any change in
the division ratio. The waiting time for exit from software standby mode also changes when
the division ratio is changed. For details, see section 20.4.3, Selection of Waiting Time for Exit
from Software Standby Mode.
Bit 0
DIV0
0
1
0
1
Usage Notes
Frequency Division Ratio
1/1
1/2
1/4
1/8
cyc
in the AC electrical characteristics. Note that ø
Rev. 2.00 Sep 20, 2005 page 589 of 800
Section 19 Clock Pulse Generator
min
= lower limit of the
REJ09B0260-0200
(Initial value)