HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 430

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 12 Serial Communication Interface
Rev. 2.00 Sep 20, 2005 page 390 of 800
REJ09B0260-0200
No
No
No
Figure 12.7 Sample Flowchart for Receiving Serial Data (cont)
Clear ORER, PER, and FER flags
Framing error handling
Overrun error handling
Parity error handling
Error handling
to 0 in SSR
ORER = 1
FER = 1
PER = 1
Break?
<End>
(3)
Yes
No
Yes
Yes
Yes
Clear RE bit to 0 in SCR

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