HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 836

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Appendix G Package Dimensions
Rev. 2.00 Sep 20, 2005 page 796 of 800
REJ09B0260-0200
P-QFP100-14x20-0.65
JEITA Package Code
100
81
e
80
1
Z
D
*1
H
D
D
RENESAS Code
PRQP0100JE-B
y
Figure G.3 Package Dimensions (FP-100A)
*3
b
p
51
30
M
FP-100A/FP-100AV
50
31
Previous Code
x
F
MASS[Typ.]
1.7g
Terminal cross section
Detail F
b
b
1
p
NOTE)
1. DIMENSIONS"*1"AND"*2"
DO NOT INCLUDE MOLD FLASH
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
L
1
L
Reference
Symbol
D
E
A
H
H
A
A
b
b
c
c
e
x
y
Z
Z
L
L
p
1
1
1
2
D
E
1
D
E
24.4
18.4
0.00
0.24
0.12
Min
1.0
0 °
Dimension in Millimeters
Nom
2.70
24.8
18.8
0.20
0.32
0.30
0.17
0.15
0.65
0.58
0.83
20
14
1.2
2.4
Max
25.2
19.2
3.10
0.30
0.40
0.22
0.13
0.15
10 °
1.4