HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 189

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

6.7
6.7.1
ABWCR, ASTCR, WCRH, and WCRL Write Timing: Data written to ABWCR, ASTCR,
WCRH, and WCRL takes effect starting from the next bus cycle. Figure 6.21 shows the timing
when an instruction fetched from area 0 changes area 0 from three-state access to two-state access.
DDR and CSCR Write Timing: Data written to DDR or CSCR for the port corresponding to the
C S
the DDR write cycle. Figure 6.22 shows the timing when the
input to
n pin to switch between
Address bus
C S
Register and Pin Input Timing
Register Write Timing
1
output.
Address bus
CS
1
3-state access to area 0
T
1
C S
Figure 6.21 ASTCR Write Timing
n output and generic input takes effect starting from the T
Figure 6.22 DDR Write Timing
T
2
High-impedance
T
3
T
1
P8DDR address
T
1
ASTCR address
T
T
2
2
Rev. 2.00 Sep 20, 2005 page 149 of 800
C S
T
3
2-state access to area 0
1
pin is changed from generic
T
3
T
1
Section 6 Bus Controller
T
REJ09B0260-0200
2
3
state of