HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 471

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

The timing of TEND flag setting depends on the GM bit in SMR.
Figure 13.4 shows timing of TEND flag setting.
For details, see Interrupt Operations in this section.
(1) GM = 0
(2) GM = 1
Serial data
TEND
TEND
Ds
Figure 13.4 Timing of TEND Flag Setting
11.0 etu
12.5 etu
Rev. 2.00 Sep 20, 2005 page 431 of 800
Section 13 Smart Card Interface
Dp
Guard time
DE
REJ09B0260-0200