HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 716

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Appendix B Internal I/O Registers
Address
(Low)
H'FFFB0 SMR
H'FFFB1 BRR
H'FFFB2 SCR
H'FFFB3 TDR
H'FFFB4 SSR
H'FFFB5 RDR
H'FFFB6 SCMR
H'FFFB7 Reserved area (access prohibited)
H'FFFB8 SMR
H'FFFB9 BRR
H'FFFBA SCR
H'FFFBB TDR
H'FFFBC SSR
H'FFFBD RDR
H'FFFBE SCMR
H'FFFBF Reserved area (access prohibited)
H'FFFC0 Reserved area (access prohibited)
H'FFFC1
H'FFFC2
H'FFFC3
H'FFFC4
H'FFFC5
H'FFFC6
H'FFFC7
H'FFFC8 —
H'FFFC9 —
H'FFFCA —
H'FFFCB —
H'FFFCC —
H'FFFCD —
H'FFFCE —
H'FFFCF —
H'FFFD0 P1DR
H'FFFD1 P2DR
H'FFFD2 P3DR
Rev. 2.00 Sep 20, 2005 page 676 of 800
REJ09B0260-0200
Register
Name
Data
Bus
Width Bit 7
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
C/A
TIE
TDRE
—
C/A
TIE
TDRE
—
—
—
—
—
—
—
—
—
P1
P2
P3
7
7
7
CHR
RIE
RDRF
—
CHR
RIE
RDRF
—
—
—
—
—
—
—
—
—
P1
P2
P3
Bit 6
6
6
6
Bit 5
PE
TE
ORER
—
PE
TE
ORER
—
—
—
—
—
—
—
—
—
P1
P2
P3
5
5
5
O/E
RE
FER/
—
O/E
RE
FER/
—
Bit 4
ERS
ERS
—
—
—
—
—
—
—
—
P1
P2
P3
4
4
4
Bit Names
STOP
MPIE
PER
SDIR
STOP
MPIE
PER
SDIR
—
—
—
—
—
—
—
—
P1
P2
P3
Bit 3
3
3
3
Bit 2
MP
TEIE
TEND
SINV
MP
TEIE
TEND
SINV
—
—
—
—
—
—
—
—
P1
P2
P3
2
2
2
Bit 1
CKS1
CKE1
MPB
—
CKS1
CKE1
MPB
—
—
—
—
—
—
—
—
—
P1
P2
P3
1
1
1
Bit 0
CKS0
CKE0
MPBT
SMIF
CKS0
CKE0
MPBT
SMIF
—
—
—
—
—
—
—
—
P1
P2
P3
0
0
0
Module Name
SCI channel 0
SCI channel 1
Port 1
Port 2
Port 3