HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 32

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Figure 17.16 Power-On/Off Timing (Boot Mode).................................................................... 523
Figure 17.17 Power-On/Off Timing (User Program Mode) ..................................................... 524
Figure 17.18 Mode Transition Timing
Figure 17.19 ROM Block Diagram (H8/3026 Mask ROM Version)........................................ 526
Figure 17.20 Mask ROM Addresses and Data.......................................................................... 527
Section 18 Flash Memory [H8/3024F-ZTAT Version]
Figure 18.1
Figure 18.2
Figure 18.3
Figure 18.4
Figure 18.5
Figure 18.6
Figure 18.7
Figure 18.8
Figure 18.9
Figure 18.10 FLMCR1 Bit Settings and State Transitions ....................................................... 556
Figure 18.11 Program/Program-Verify Flowchart (128-Byte Programming)........................... 561
Figure 18.12 Erase/Erase-Verify Flowchart (Single-Block Erasing) ........................................ 564
Figure 18.13 Flash Memory State Transitions (When High Level is Applied to FWE Pin
Figure 18.14 Example of RAM Overlap Operation .................................................................. 569
Figure 18.15 Memory Map in PROM Mode............................................................................. 572
Figure 18.16 Power-On/Off Timing (Boot Mode).................................................................... 576
Figure 18.17 Power-On/Off Timing (User Program Mode) ..................................................... 577
Figure 18.18 Mode Transition Timing
Section 19 Clock Pulse Generator
Figure 19.1
Figure 19.2
Figure 19.3
Figure 19.4
Figure 19.5
Figure 19.6
Figure 19.7
Section 20 Power-Down State
Figure 20.1
Figure 20.2
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(Example: Boot Mode
Block Diagram of Flash Memory ........................................................................ 531
Example of ROM Area/RAM Area Overlap ....................................................... 541
Flash Memory Related State Transitions............................................................. 542
Reading Overlap RAM Data in User Mode/User Program Mode ....................... 545
Writing Overlap RAM Data in User Program Mode ........................................... 546
System Configuration When Using Boot Mode .................................................. 548
Boot Mode Execution Procedure......................................................................... 549
RAM Areas in Boot Mode................................................................................... 551
Example of User Program Mode Execution Procedure ....................................... 554
in Mode 5 or 7 (On-Chip ROM Enabled))........................................................... 568
(Example: Boot Mode
Block Diagram of Clock Pulse Generator ........................................................... 582
Connection of Crystal Resonator (Example) ....................................................... 583
Crystal Resonator Equivalent Circuit .................................................................. 584
Oscillator Circuit Block Board Design Precautions ............................................ 584
External Clock Input (Examples) ........................................................................ 585
External Clock Input Timing ............................................................................... 587
External Clock Output Settling Delay Timing..................................................... 587
NMI Timing for Software Standby Mode (Example).......................................... 601
Hardware Standby Mode Timing......................................................................... 603
User Mode
User Mode
User Program Mode) .......................... 525
User Program Mode) .......................... 578