HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 616

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 18 Flash Memory [H8/3024F-ZTAT Version]
Rev. 2.00 Sep 20, 2005 page 576 of 800
REJ09B0260-0200
V
FWE
MD
RES
SWE bit
Notes: 1. Except when switching modes, the level of the mode pins (MD
CC
2
to MD
Period during which flash memory access is prohibited
(x: Wait time after setting SWE bit, y: Wait time after clearing SWE bit) *
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations
prohibited)
2. See section 21.2.6, Flash Memory Characteristics.
0
by pulling the pins up or down.
*
1
Figure 18.16 Power-On/Off Timing (Boot Mode)
t
OSC1
t
SWE set
MDS
t
MDS
Wait time:
x
Program-
ming/
erasing
possible
Wait time:
y
Min 0 s
2
–MD
SWE cleared
2
0
) must be fixed until power-off
Min 0 s