HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 532

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 17 Flash Memory [H8/3026F-ZTAT Version]
17.4.4
The flash memory in the H8/3026F-ZTAT version is divided into three 64-kbyte blocks, one 32-
kbyte block, and eight 4-kbyte blocks. Erasing can be carried out in block units.
Rev. 2.00 Sep 20, 2005 page 492 of 800
REJ09B0260-0200
Block Configuration
Figure 17.4 Writing Overlap RAM Data in User Program Mode
Application program
Flash memory
Program data
Address H'3FFFF
Address H'00000
256 kbytes
4 kbytes
64 kbytes
64 kbytes
32 kbytes
64 kbytes
Programming control program
8
Execution state
(program data)
Overlap RAM
RAM
SCI