HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 235

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Pin
PA
TIOCA
4
/TP
1
4
/A
/
23
Pin Functions and Selection Method
Bit PWM1 in TMDR, bits IOA2 to IOA0 in TIOR1, bit NDER4 in NDERA, bit A23E in
BRCR, and bit PA
A23E
16-bit timer
channel 1 settings
PA
NDER4
Pin function
Note: * TIOCA
16-bit timer
channel 1 settings
PWM1
IOA2
IOA1
IOA0
4
DDR
1
input when IOA2 = 1.
4
DDR select the pin function as follows.
(1) in table below
TIOCA
(2)
0
0
1
output
0
1
0
(1)
0
Rev. 2.00 Sep 20, 2005 page 195 of 800
input
PA
1
0
1
4
(2) in table below
TIOCA
output
PA
(2)
1
1
0
1
4
input *
Section 7 I/O Ports
output
REJ09B0260-0200
TP
1
1
4
(1)
1
output
A
0
23

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