HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 786

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Appendix B Internal I/O Registers
RDR—Receive Data Register
SCMR—Smart Card Mode Register
SMR—Serial Mode Register
Rev. 2.00 Sep 20, 2005 page 746 of 800
REJ09B0260-0200
Initial value
Read/Write
Initial value
Read/Write
Initial value
Read/Write
Note: Bit functions are the same as for SCI0.
Bit
Bit
Bit
—
—
7
1
R/W
C/A
R
7
0
7
0
—
—
6
1
CHR
R/W
—
—
5
1
R
6
0
6
0
—
—
4
1
R/W
PE
Smart card data transfer direction
R
5
0
5
0
0
1
SDIR
R/W
3
0
TDR contents are transmitted LSB-first
Receive data is stored LSB-first in RDR
TDR contents are transmitted MSB-first
Receive data is stored MSB-first in RDR
Smart card data invert
0
1
SINV
Serial receive data
R/W
R/W
O/E
2
0
R
4
0
4
0
Unmodified TDR contents are transmitted
Receive data is stored unmodified in RDR
Inverted 1/0 logic levels of TDR contents are transmitted
1/0 logic levels of received data are inverted before storage in RDR
H'FFFB5
H'FFFB6
H'FFFB8
Smart card interface mode select
0
1
—
—
1
1
Smart card interface function is disabled
Smart card interface function is enabled
STOP
R/W
R
3
0
3
0
SMIF
R/W
0
0
R/W
MP
R
2
0
2
0
(Initial value)
CKS1
R/W
R
1
0
1
0
(Initial value)
(Initial value)
CKS0
R/W
R
0
0
0
0
SCI0
SCI0
SCI1