HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 119

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
4.5
Figure 4.6 shows the stack after completion of trap instruction exception handling and interrupt
exception handling.
SP–4
SP–3
SP–2
SP–1
SP (ER7)
SP–4
SP–3
SP–2
SP–1
SP (ER7)
Legend
PC
PC
PC
CCR:
SP:
Notes:
E
H
L
:
:
:
Bits 23 to 16 of program counter (PC)
Bits 15 to 8 of program counter (PC)
Bits 7 to 0 of program counter (PC)
Condition code register
Stack pointer
*
Stack Status after Exception Handling
Ignored at return.
1.
2.
PC indicates the address of the first instruction that will be executed after return.
Registers must be saved in word or longword size at even addresses.
Before exception handling
Before exception handling
Figure 4.6 Stack after Completion of Exception Handling
Stack area
Stack area
b. Advanced mode
Pushed on stack
a. Normal mode
Pushed on stack
SP (ER7)
SP+1
SP+2
SP+3
SP+4
SP (ER7)
SP+1
SP+2
SP+3
SP+4
Rev. 2.00 Sep 20, 2005 page 79 of 800
After exception handling
After exception handling
CCR
PC
PC
PC
Section 4 Exception Handling
CCR
CCR *
PC
PC
H
L
E
H
L
REJ09B0260-0200
Even address
Even address

Related parts for HD64F3026X25