HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 692

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Appendix A Instruction Set
7. System control instructions
Rev. 2.00 Sep 20, 2005 page 652 of 800
REJ09B0260-0200
Mnemonic
TRAPA #x:2
RTE
SLEEP
LDC #xx:8, CCR
LDC Rs, CCR
LDC @ERs, CCR
LDC @(d:16, ERs),
CCR
LDC @(d:24, ERs),
CCR
LDC @ERs+, CCR
LDC @aa:16, CCR
LDC @aa:24, CCR
STC CCR, Rd
STC CCR, @ERd
STC CCR, @(d:16,
ERd)
STC CCR, @(d:24,
ERd)
STC CCR, @–ERd
STC CCR, @aa:16
STC CCR, @aa:24
ANDC #xx:8, CCR
ORC #xx:8, CCR
XORC #xx:8, CCR
NOP
W
W
W
W
W
W
W
W
W
W
W
W
B
B
B
B
B
B
2
2
2
2
Instruction Length (bytes)
2
2
Addressing Mode and
4
4
10
10
6
6
4
4
6
8
6
8
2
2
Operation
PC
CCR
<vector>
CCR
PC
Transition to powerdown
state
#xx:8
Rs8
@ERs
@(d:16, ERs)
@(d:24, ERs)
@ERs
ERs32+2
@aa:16
@aa:24
CCR
CCR
CCR
CCR
ERd32–2
CCR
CCR
CCR
CCR #xx:8
CCR #xx:8
CCR #xx:8
PC
@–SP
@SP+
PC+2
CCR
@–SP
@SP+
Rd8
@ERd
@(d:16, ERd)
@(d:24, ERd)
@ERd
@aa:16
@aa:24
CCR
CCR
CCR
CCR
CCR
PC
ERs32
ERd32
CCR
CCR
CCR
CCR
CCR
— — — — — —
— — — — — —
— — — — — —
— — — — — —
— — — — — —
— — — — — —
— — — — — —
— — — — — —
— — — — — —
1 — — — — —
I
Condition Code
H N Z
V C
States *
14 16
No. of
10
12
10
12
10
2
2
2
6
8
8
8
2
6
8
8
8
2
2
2
2
1

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