HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 748

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Appendix B Internal I/O Registers
EBR (EBR2)—Erase Block Register 2
Rev. 2.00 Sep 20, 2005 page 708 of 800
REJ09B0260-0200
Modes 1 to
4, and 6
Modes 5
and 7
Bit
Initial value
Read/Write
Initial value
Read/Write
Note: When not erasing, clear EBR to H'00.
R/W
—
R
7
0
0
A value of 1 cannot be set in this register in mode 6.
H8/3024F-ZTAT
H8/3026F-ZTAT
H8/3024 mask ROM version
H8/3026 mask ROM version
R/W
—
R
0
0
6
R/W
Block 11 to 8
—
R
5
0
0
0
1
Block EB11 to EB8 is not selected (Initial value)
Block EB11 to EB8 is selected
H'EE033
R/W
—
R
4
0
0
This register not provided
This register provided
This register not provided
EB11
R/W
R
3
0
0
EB10
R/W
R
2
0
0
EB9
R/W
R
0
0
Flash Memory
1
R/W
EB8
R
0
0
0