HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 678

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 21 Electrical Characteristics
21.3.6
SCI timing is shown as follows:
Rev. 2.00 Sep 20, 2005 page 638 of 800
REJ09B0260-0200
SCK
SCK
TxD
(transmit
data)
RxD
(receive
data)
TCLKA to
TCLKD
SCI input clock timing
Figure 21.18 shows the SCI input clock timing.
SCI input/output timing (synchronous mode)
Figure 21.19 shows the SCI input/output timing in synchronous mode.
0
0
0
1
, TxD
, RxD
,
SCK
SCI Input/Output Timing
1
1
0
, SCK
Figure 21.19 SCI Input/Output Timing in Synchronous Mode
1
Figure 21.17 Timer External Clock Input Timing
t
TCKWL
t
Figure 21.18 SCI Input Clock Timing
TXD
t
Scyc
t
SCKW
t
TCKS
t
RXS
t
RXH
t
TCKWH
t
Scyc
t
SCKr
t
SCKf
t
TCKS

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