HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 181

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
6.4.6
When accessing external space, the H8/3024 Group can extend the bus cycle by inserting wait
states (T
insertion using the
Program Wait Insertion: From 0 to 3 wait states can be inserted automatically between the T
state and T
of WCRH and WCRL.
Figure 6.15 Bus Control Signal Timing for 16-Bit, Two-State-Access Area (3)
w
). There are two ways of inserting wait states: program wait insertion and pin wait
Wait Control
3
state on an individual area basis in three-state access space, according to the settings
Read access
Write access
Note: n = 7 to 0
W A I T
pin.
Address bus
D
D
D
D
HWR
15
LWR
15
CS
7
7
RD
AS
to D
to D
to D
to D
n
0
0
8
8
(Word Access)
External address in area n
T
1
Bus cycle
Rev. 2.00 Sep 20, 2005 page 141 of 800
Valid
Valid
T
Valid
Valid
2
Section 6 Bus Controller
REJ09B0260-0200
2

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