HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 787

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

BRR—Bit Rate Register
SCR—Serial Control Register
TDR—Transmit Data Register
Note: Bit functions are the same as for SCI0.
SSR—Serial Status Register
Notes: Bit functions are the same as for SCI0.
Initial value
Read/Write
Initial value
Read/Write
Initial value
Read/Write
Initial value
Read/Write
Note: Bit functions are the same as for SCI0.
Note: Bit functions are the same as for SCI0.
* Only 0 can be written to clear the flag.
Bit
Bit
Bit
Bit
R/W
R/W
TIE
R/(W) *
TDRE
7
1
7
0
R/W
7
1
7
0
R/W
R/W
RIE
R/(W) *
RDRF
6
1
6
0
R/W
6
1
6
0
R/W
R/W
R/(W) *
ORER
TE
5
1
5
0
R/W
5
1
5
0
FER/ERS
R/(W) *
R/W
R/W
RE
R/W
4
1
4
0
4
1
4
0
H'FFFB9
H'FFFBA
H'FFFBB
H'FFFBC
Rev. 2.00 Sep 20, 2005 page 747 of 800
MPIE
R/(W) *
R/W
R/W
PER
R/W
3
1
3
0
3
1
3
0
Appendix B Internal I/O Registers
TEIE
TEND
R/W
R/W
R/W
2
1
2
0
R
2
1
2
1
REJ09B0260-0200
CKE1
R/W
R/W
MPB
R/W
1
1
1
0
R
1
1
1
0
MPBT
CKE0
R/W
R/W
R/W
R/W
0
1
0
0
0
1
0
0
SCI1
SCI1
SCI1
SCI1