HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 556

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 17 Flash Memory [H8/3026F-ZTAT Version]
Rev. 2.00 Sep 20, 2005 page 516 of 800
REJ09B0260-0200
H'3FFFF
H'00000
H'01000
H'02000
H'03000
H'04000
H'05000
H'06000
H'07000
H'08000
Figure 17.14 Example of RAM Overlap Operation
Flash memory
EB8 to EB11
EB0
EB1
EB2
EB3
EB4
EB5
EB6
EB7
This area can be accessed
from both the RAM area
and flash memory area
On-chip RAM
H'FFE000
H'FFEFFF
H'FFFF1F

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