HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 509

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

An example of D/A conversion on channel 0 is given next. Timing is indicated in figure 15.2.
1. Data to be converted is written in DADR0.
2. Bit DAOE0 is set to 1 in DACR. D/A conversion starts and DA
3. If the DADR0 value is modified, conversion starts immediately, and the result is output after
4. When the DAOE0 bit is cleared to 0, DA0 becomes an input pin.
Address
DADR0
DAOE0
DA
Legend:
t
DCONV
converted result is output after the conversion time.
The output value is
Output of this conversion result continues until the value in DADR0 is modified or the
DAOE0 bit is cleared to 0.
the conversion time.
0
: D/A conversion time
DADR0
write cycle
High-impedance state
Figure 15.2 Example of D/A Converter Operation
DADR contents
DACR
write cycle
256
Conversion data 1
t
DCONV
V
REF
Conversion
result 1
Rev. 2.00 Sep 20, 2005 page 469 of 800
DADR0
write cycle
0
becomes an output pin. The
t
DCONV
Section 15 D/A Converter
Conversion data 2
REJ09B0260-0200
Conversion
result 2
DACR
write cycle