HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 21

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
17.9 NMI Input Disabling Conditions ...................................................................................... 518
17.10 Flash Memory PROM Mode ............................................................................................ 519
17.11 Flash Memory Programming and Erasing Precautions..................................................... 520
17.12 Mask ROM (H8/3026 Mask ROM Version) Overview.................................................... 526
17.13 Notes on Ordering Mask ROM Version Chip .................................................................. 527
17.14 Notes when Converting the F-ZTAT Application Software to the Mask ROM Versions 528
Section 18 Flash Memory [H8/3024F-ZTAT Version]
18.1 Overview........................................................................................................................... 529
18.2 Features............................................................................................................................. 530
18.3 Register Descriptions........................................................................................................ 533
18.4 Overview of Operation ..................................................................................................... 541
18.5 On-Board Programming Mode ......................................................................................... 547
18.6 Flash Memory Programming/Erasing............................................................................... 555
18.7 Flash Memory Protection.................................................................................................. 565
18.8 Flash Memory Emulation in RAM ................................................................................... 569
18.9 NMI Input Disabling Conditions ...................................................................................... 570
18.10 Flash Memory PROM Mode ............................................................................................ 571
17.10.1 Socket Adapters and Memory Map ..................................................................... 519
17.10.2 Notes on Use of PROM Mode............................................................................. 520
17.12.1 Block Diagram..................................................................................................... 526
18.2.1 Block Diagram..................................................................................................... 531
18.2.2 Pin Configuration ................................................................................................ 532
18.2.3 Register Configuration......................................................................................... 532
18.3.1 Flash Memory Control Register 1 (FLMCR1) .................................................... 533
18.3.2 Flash Memory Control Register 2 (FLMCR2) .................................................... 536
18.3.3 Erase Block Register (EBR) ................................................................................ 538
18.3.4 RAM Control Register (RAMCR)....................................................................... 539
18.4.1 Mode Transitions ................................................................................................. 541
18.4.2 On-Board Programming Modes........................................................................... 543
18.4.3 Flash Memory Emulation in RAM ...................................................................... 545
18.4.4 Block Configuration ............................................................................................ 546
18.5.1 Boot Mode ........................................................................................................... 548
18.5.2 User Program Mode............................................................................................. 553
18.6.1 Program Mode ..................................................................................................... 557
18.6.2 Program-Verify Mode ......................................................................................... 557
18.6.3 Erase Mode .......................................................................................................... 562
18.6.4 Erase-Verify Mode .............................................................................................. 563
18.7.1 Hardware Protection ............................................................................................ 565
18.7.2 Software Protection ............................................................................................. 566
18.7.3 Error Protection ................................................................................................... 567
Rev. 2.00 Sep 20, 2005 page xix of xxxviii
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