HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 699

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Table A.4
Instruction Mnemonic
ADD
ADDS
ADDX
AND
ANDC
BAND
Bcc
ADD.B #xx:8, Rd
ADD.B Rs, Rd
ADD.W #xx:16, Rd
ADD.W Rs, Rd
ADD.L #xx:32, ERd
ADD.L ERs, ERd
ADDS #1/2/4, ERd
ADDX #xx:8, Rd
ADDX Rs, Rd
AND.B #xx:8, Rd
AND.B Rs, Rd
AND.W #xx:16, Rd
AND.W Rs, Rd
AND.L #xx:32, ERd
AND.L ERs, ERd
ANDC #xx:8, CCR
BAND #xx:3, Rd
BAND #xx:3, @ERd
BAND #xx:3, @aa:8
BRA d:8 (BT d:8)
BRN d:8 (BF d:8)
BHI d:8
BLS d:8
BCC d:8 (BHS d:8)
BCS d:8 (BLO d:8)
BNE d:8
BEQ d:8
BVC d:8
BVS d:8
BPL d:8
BMI d:8
BGE d:8
BLT d:8
BGT d:8
BLE d:8
Number of Cycles per Instruction
Instruction
Fetch
I
1
1
2
1
3
1
1
1
1
1
1
2
1
3
2
1
1
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Branch
Addr. Read
J
Rev. 2.00 Sep 20, 2005 page 659 of 800
Stack
Operation
K
Byte Data
Access
L
1
1
Appendix A Instruction Set
Word Data
Access
M
REJ09B0260-0200
Internal
Operation
N