HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 478

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 13 Smart Card Interface
The receive margin can therefore be expressed as follows.
Receive margin in smart card interface mode:
From the above equation, if F = 0 and D = 0.5, the receive margin is as follows.
When D = 0.5 and F = 0:
Rev. 2.00 Sep 20, 2005 page 438 of 800
REJ09B0260-0200
M = (0.5 –
M: Receive margin (%)
N: Ratio of clock frequency to bit rate (N = 372)
D: Clock duty cycle (L = 0 to 1.0)
L: Frame length (L =10)
F: Absolute deviation of clock frequency
M = (0.5 – 1/2
= 49.866%
2N
1
372)
) – (L – 0.5) F –
100%
D – 0.5
N
(1 + F)
100%

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