HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 706

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Appendix A Instruction Set
Notes: 1. n is the value set in register R4L or R4. The source and destination are accessed n + 1
Rev. 2.00 Sep 20, 2005 page 666 of 800
REJ09B0260-0200
Instruction Mnemonic
XOR
XORC
2. Not available in the H8/3024 Group.
XOR.B #xx:8, Rd
XOR.B Rs, Rd
XOR.W #xx:16, Rd
XOR.W Rs, Rd
XOR.L #xx:32, ERd
XOR.L ERs, ERd
XORC #xx:8, CCR
times each.
Instruction
Fetch
I
1
1
2
1
3
2
1
Branch
Addr. Read
J
Stack
Operation
K
Byte Data
Access
L
Word Data
Access
M
Internal
Operation
N