HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 190

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 6 Bus Controller
BRCR Write Timing: Data written to BRCR to switch between A
, A
, A
, or A
output and
23
22
21
20
generic input or output takes effect starting from the T
state of the BRCR write cycle. Figure
3
6.23 shows the timing when a pin is changed from generic input to A
, A
, A
, or A
output.
23
22
21
20
T
T
T
1
2
3
Address bus
BRCR address
PA
to PA
7
4
( A
to A
High-impedance
)
23
20
Figure 6.23 BRCR Write Timing
6.7.2
Pin Input Timing
B R E Q
After driving the
pin low, hold it low until
goes low. If
returns to the high
B R E Q
B A C K
B R E Q
level before
goes lows, the bus arbiter may operate incorrectly.
B A C K
To terminate the external-bus-released state, hold the
signal high for at least three states. If
B R E Q
is high for too short an interval, the bus arbiter may operate incorrectly.
B R E Q
Rev. 2.00 Sep 20, 2005 page 150 of 800
REJ09B0260-0200

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