HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 48

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 1 Overview
Rev. 2.00 Sep 20, 2005 page 8 of 800
REJ09B0260-0200
Note: * Functions as the RES0 pin in the mask ROM version, and as the FWE pin in the F-ZTAT version.
TCLKC/TIOCA
TCLKD/TIOCB
ADTRG/CS
A
A
A
A
23
22
21
20
/TIOCA
/TIOCB
/TIOCA
/TIOCB
TCLKA/TP
TCLKB/TP
CS
P7 /AN /DA
P7 /AN /DA
CS
Figure 1.2 Pin Arrangement of H8/3024F-ZTAT, H8/3026F-ZTAT,
6
7
3
2
1
/IRQ
IRQ
/IRQ
/IRQ
0
0
1
1
2
2
P7 /AN
P7 /AN
P7 /AN
P7 /AN
P7 /AN
P7 /AN
H8/3024 Mask ROM Version, and H8/3026 Mask ROM Version
/TP
/TP
/TP
/TP
/TP
/TP
CS
0
1
2
3
4
5
AV
6
7
0
AV
V
1
2
3
0
0
1
2
3
4
5
6
7
/P8
/P8
/P8
/P8
/P8
/PA
/PA
/PA
/PA
/PA
/PA
/PA
/PA
REF
V
CC
SS
SS
0
0
1
2
3
4
5
0
1
1
2
3
4
0
1
2
3
4
5
6
7
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
(FP-100B or TFP-100B Package, Top View)
(FP-100B, TFP-100B)
Top view
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
P2
P2
P2
P2
P2
P2
V
P1
P1
P1
P1
P1
P1
P1
P1
V
D
D
D
D
D
D
D
D
D
SS
CC
15
14
13
12
11
10
9
8
7
/P3
/P3
/P4
5
4
3
2
1
0
7
6
5
4
3
2
1
0
/P3
/P3
/P3
/P3
/P3
/P3
/A
/A
/A
/A
/A
/A
/A
/A
/A
/A
/A
/A
/A
/A
13
12
11
10
9
8
7
6
5
4
3
2
1
0
1
0
7
7
6
5
4
3
2