HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 579

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Table 18.4 Flash Memory Erase Blocks
Block (Size)
EB0 (1 kbyte)
EB1 (1 kbyte)
EB2 (1 kbyte)
EB3 (1 kbyte)
EB4 (28 kbytes)
EB5 (32 kbytes)
EB6 (32 kbytes)
EB7 (32 kbytes)
18.3.4
RAMCR selects the RAM area to be used when emulating real-time flash memory programming.
Note: * Cannot be set to 1 in mode 6.
Bits 7 to 4—Reserved: Read-only bits, always read as 1.
Modes 1
to 4
Modes 5
to 7
RAM Control Register (RAMCR)
Bit
Initial value
Read/Write
Initial value
Read/Write
7
1
1
Reserved bits
Address
H'000000–H'0003FF
H'000400–H'0007FF
H'000800–H'000BFF
H'000C00–H'000FFF
H'001000–H'007FFF
H'008000–H'00FFFF
H'010000–H'017FFF
H'018000–H'01FFFF
6
1
1
5
1
1
Section 18 Flash Memory [H8/3024F-ZTAT Version]
4
1
1
RAM select
Used together with bits 2 and 1 to select
a flash memory area
Rev. 2.00 Sep 20, 2005 page 539 of 800
RAMS
R/W *
R
3
0
0
RAM2, RAM1
Used together with bit 3 to select
a flash memory area
RAM2
R/W *
R
2
0
0
RAM1
R/W *
REJ09B0260-0200
R
1
0
0
Reserved bit
0
1
1

Related parts for HD64F3026X25