HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 702

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Appendix A Instruction Set
Rev. 2.00 Sep 20, 2005 page 662 of 800
REJ09B0260-0200
Instruction Mnemonic
DAS
DEC
DIVXS
DIVXU
EEPMOV
EXTS
EXTU
INC
JMP
JSR
LDC
DAS Rd
DEC.B Rd
DEC.W #1/2, Rd
DEC.L #1/2, ERd
DIVXS.B Rs, Rd
DIVXS.W Rs, ERd
DIVXU.B Rs, Rd
DIVXU.W Rs, ERd
EEPMOV.B
EEPMOV.W
EXTS.W Rd
EXTS.L ERd
EXTU.W Rd
EXTU.L ERd
INC.B Rd
INC.W #1/2, Rd
INC.L #1/2, ERd
JMP @ERn
JMP @aa:24
JMP @@aa:8 Normal
JSR @ERn
JSR @aa:24 Normal
JSR @@aa:8 Normal
LDC #xx:8, CCR
LDC Rs, CCR
LDC @ERs, CCR
LDC @(d:16, ERs), CCR
LDC @(d:24, ERs), CCR
LDC @ERs+, CCR
LDC @aa:16, CCR
LDC @aa:24, CCR
Advanced 2
Normal
Advanced 2
Advanced 2
Advanced 2
Instruction
Fetch
I
1
1
1
1
2
2
1
1
2
2
1
1
1
1
1
1
1
2
2
2
2
2
2
1
1
2
3
5
2
3
4
Branch
Addr. Read
J
1
2
1
2
Stack
Operation
K
1
2
1
2
1
2
Byte Data
Access
L
2n + 2 *
2n + 2 *
1
1
Word Data
Access
M
1
1
1
1
1
1
Internal
Operation
N
12
20
12
20
2
2
2
2
2
2

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