HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 39

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Table 18.6
Table 18.7
Table 18.8
Table 18.9
Table 18.10
Section 19 Clock Pulse Generator
Table 19.1 (1) Damping Resistance Value.................................................................................. 583
Table 19.1 (2) External Capacitance Values ............................................................................... 583
Table 19.2
Table 19.3 (1) Clock Timing for On-Chip Flash Memory Versions ........................................... 586
Table 19.3 (2) Clock Timing for On-Chip Mask ROM Versions ............................................... 586
Table 19.4
Section 20 Power-Down State
Table 20.1
Table 20.2
Table 20.3
Table 20.4
Section 21 Electrical Characteristics
Table 21.1
Table 21.2
Table 21.3
Table 21.4
Table 21.5
Table 21.6
Table 21.7
Table 21.8
Table 21.9
Table 21.10
Table 21.11
Table 21.12
Table 21.13
Table 21.14
Table 21.15
Table 21.16
Table 21.17
Table 21.18
Table 21.19
On-Board Programming Mode Settings .............................................................. 547
Hardware Protection ............................................................................................ 565
Software Protection ............................................................................................. 566
H8/3024F-ZTAT Version Socket Adapter Product Codes .................................. 572
Crystal Resonator Parameters.............................................................................. 584
Frequency Division Register ............................................................................... 588
Power-Down State and Module Standby Function.............................................. 592
Control Register................................................................................................... 593
Clock Frequency and Waiting Time for Clock to Settle...................................... 600
Absolute Maximum Ratings ................................................................................ 607
DC Characteristics ............................................................................................... 608
Permissible Output Currents................................................................................ 610
A/D Conversion Characteristics .......................................................................... 616
D/A Conversion Characteristics .......................................................................... 617
Absolute Maximum Ratings ................................................................................ 618
DC Characteristics ............................................................................................... 619
Permissible Output Currents................................................................................ 621
A/D Conversion Characteristics .......................................................................... 627
D/A Conversion Characteristics .......................................................................... 628
Flash Memory Characteristics ............................................................................. 629
System Clock Frequencies for which Automatic Adjustment
of H8/3024F-ZTAT Version Bit Rate is Possible................................................ 550
Clock Timing ....................................................................................................... 612
Control Signal Timing ......................................................................................... 612
Bus Timing .......................................................................................................... 613
Timing of On-Chip Supporting Modules............................................................. 614
Clock Timing ....................................................................................................... 623
Control Signal Timing ......................................................................................... 623
Bus Timing .......................................................................................................... 624
Timing of On-Chip Supporting Modules............................................................. 625
Pin State in Various Operating States............................................................... 605
Rev. 2.00 Sep 20, 2005 page xxxvii of xxxviii