HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 511

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

16.1
The H8/3024 Group has high-speed static RAM on-chip. The RAM is connected to the CPU by a
16-bit data bus. The CPU accesses both byte data and word data in two states, making the RAM
useful for rapid data transfer.
The on-chip RAM can be enabled or disabled with the RAM enable bit (RAME) in the system
control register (SYSCR). When the on-chip RAM is disabled, that area is assigned to external
space in the expanded modes. The on-chip RAM specifications for the product lineup are shown
in table 16.1.
Table 16.1 H8/3024 Group On-Chip RAM Specifications
RAM size
Address
assignment
Overview
Modes 1, 2, 7
Modes 3, 4, 5
Mode 6
H8/3024F-ZTAT
4 kbytes
H'FEF20
to
H'FFF1F
H'FFEF20
to
H'FFFF1F
H'FE20
to
H'FF1F
Section 16 RAM
H8/3024 Mask
ROM Version
4 kbytes
H'FEF20
to
H'FFF1F
H'FFEF20
to
H'FFFF1F
H'FE20
to
H'FF1F
Rev. 2.00 Sep 20, 2005 page 471 of 800
H8/3026F-ZTAT
8 kbytes
H'FDF20
to
H'FFF1F
H'FFDF20
to
H'FFFF1F
H'FD20
to
H'FF1F
REJ09B0260-0200
Section 16 RAM
H8/3026 Mask
ROM Version
8 kbytes
H'FDF20
to
H'FFF1F
H'FFDF20
to
H'FFFF1F
H'FD20
to
H'FF1F