HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 829

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

D.2
Modes 1 and 2: Figure D.1 is a timing diagram for the case in which
external memory access in mode 1 or 2. As soon as
input state.
The address bus is initialized to the low output level 2.5 clock cycles after the low level of
is sampled. Clock pin P6
P6
RES
Internal reset
signal
A
CS
AS, RD
(read)
HWR, LWR
(write)
D
(write)
I/O port,
CS
19
15
7
0
7
Pin States at Reset
/
to A
to D
to CS
A S
,
0
0
R D
1
Figure D.1 Reset during Memory Access (Modes 1 and 2)
,
H W R
7
/ goes to the output state at the next rise of after
,
L W R
, and
Access to external
T1
C S
memory
0
go high, and D
T2
T3
R E S
goes low, all ports are initialized to the
Rev. 2.00 Sep 20, 2005 page 789 of 800
15
to D
0
go to the high-impedance state.
High-impedance
High-impedance
R E S
H'00000
goes low during an
Appendix D Pin States
R E S
REJ09B0260-0200
goes low.
R E S