HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 168

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 6 Bus Controller
Table 6.3
ABWCR ASTCR WCRH/WCRL
ABWn
0
1
Note: n = 0 to 7
6.3.3
As its memory interface, the H8/3024 Group has only a basic bus interface that allows direct
connection of ROM, SRAM, and so on. It is not possible to select a DRAM interface that allows
direct connection of DRAM, or a burst ROM interface that allows direct connection of burst
ROM.
Rev. 2.00 Sep 20, 2005 page 128 of 800
REJ09B0260-0200
ASTn
0
1
0
1
Memory Interfaces
Bus Specifications for Each Area (Basic Bus Interface)
Wn1
—
0
1
—
0
1
Wn0
—
0
1
0
1
—
0
1
0
1
Bus Specifications (Basic Bus Interface)
Bus Width
16
8
Access States
2
3
2
3
Program Wait States
0
0
1
2
3
0
0
1
2
3