MK30DN512ZVLK10 Freescale Semiconductor, MK30DN512ZVLK10 Datasheet - Page 477
MK30DN512ZVLK10
Manufacturer Part Number
MK30DN512ZVLK10
Description
ARM Microcontrollers - MCU KINETIS 512K SLCD
Manufacturer
Freescale Semiconductor
Datasheet
1.MK30DN512ZVLK10.pdf
(1547 pages)
Specifications of MK30DN512ZVLK10
Core
ARM Cortex M4
Processor Series
K30
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
512 KB
Data Ram Size
128 KB
On-chip Adc
Yes
Operating Supply Voltage
1.71 V to 3.6 V
Operating Temperature Range
- 40 C to + 105 C
Package / Case
LQFP-80
Mounting Style
SMD/SMT
Available stocks
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Price
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Part Number:
MK30DN512ZVLK10
Manufacturer:
Freescale Semiconductor
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Chapter 22
External Watchdog Monitor (EWM)
22.1 Introduction
The watchdog is generally used to monitor the flow and execution of embedded software
within an MCU. The watchdog consists of a counter that if allowed to overflow, forces an
internal reset (asynchronous) to all on-chip peripherals and optionally assert the RESET
pin to reset external devices/circuits. The overflow of the watchdog counter must not
occur if the software code works well and services the watchdog to re-start the actual
counter.
For safety, a redundant watchdog system, External Watchdog Monitor (EWM), is
designed to monitor external circuits, as well as the MCU software flow. This provides a
back-up mechanism to the internal watchdog that resets the MCU's CPU and peripherals.
The EWM differs from the internal watchdog in that it does not reset the MCU's CPU
and peripherals. The EWM if allowed to time-out, provides an independent EWM_out
pin that when asserted resets or places an external circuit into a safe mode. The CPU
resets the EWM counter that is logically ANDed with an external digital input pin. This
pin allows an external circuit to influence the reset_out signal.
22.1.1 Features
Features of EWM module include:
Freescale Semiconductor, Inc.
• Independent LPO clock source
• Programmable time-out period specified in terms of number of EWM LPO clock
cycles.
For the chip-specific implementation details of this module's
instances see the chip configuration chapter.
K30 Sub-Family Reference Manual, Rev. 6, Nov 2011
NOTE
477
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