mpc823rg Freescale Semiconductor, Inc, mpc823rg Datasheet - Page 1143

• Manufacturer Part Number: mpc823rg
• Description: Mpc823 Powerquicc Integrated Communications Processor For Portable Systems
• Manufacturer: Freescale Semiconductor, Inc

23.3 PBGA PACKAGE DIMENSIONS
The following figure is a 23x23mm package, which has 1.27mm spacing between pads. The
device designator for the MPC823 in this package is ZT. For more information on the printed
circuit board layout of the plastic ball grid array (PBGA) package, including thermal via
design and suggested pad layout, please refer to AN-1231/D, Plastic Ball Grid Array
Application Note available from your local Motorola sales office.
C
A1
A
SIDE VIEW
256X
SEATING
PLANE
A2
A3
0.35 C
0.20 C
4X
(E1)
0.20
Freescale Semiconductor, Inc.
4X
15X
For More Information On This Product,
E
e /2
B
A
e
E2
MPC823 REFERENCE MANUAL
BOTTOM VIEW
Go to: www.freescale.com
1
2
3
4
5
6
TOP VIEW
7
(D1)
8 9 10 11 12 13 14 15 16
D2
15X
D
256X
e
0.30
0.15
b
Mechanical Data and Ordering Information
M
M
C A B
C
M
T
R
P
N
L
K
H
G
F
E
D
C
B
A
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
2. DIMENSIONS IN MILLIMETERS.
3. DIMENSION b IS MEASURED AT THE MAXIMUM
4. PRIMARY DATUM C AND THE SEATING PLANE
Y14.5M, 1994.
SOLDER BALL DIAMETER, PARALLEL TO
PRIMARY DATUM C.
ARE DEFINED BY THE SPHERICAL CROWNS OF
THE SOLDER BALLS.
DIM
A1
A2
A3
D1
D2
E1
E2
A
D
E
b
e
19.00
19.00
MILLIMETERS
MIN
1.91
0.50
1.12
0.29
0.60
23.00 BSC
23.00 BSC
19.05 REF
19.05 REF
1.27 BSC
20.00
20.00
MAX
2.35
0.70
1.22
0.43
0.90
CASE 1130-01
ISSUE A
23-3